Description
UFSP’s Copper powders are engineered for metal injection molding (MIM) and
metal additive manufacturing (AM) technolgies, including binder jet technology (BJT),
material extrusion (MEX), and vat photopolymerization (VPP)
Our standard composition is
| Cu | Balance |
| Fe | <0.025% |
| N | <0.002% |
| O | Varies with size |
| S | <0.002% |
| C | <0.015% |
Our standard sizes are
| <16 µm | MIM, MEX, VPP |
| <22 µm | MIM, MEX, VPP, BJT |
| <31 µm | BJT |
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